Ceva and Actions Technology are collaborating on the ATS296X family of wireless-audio SoCs. The chips integrate Ceva-Waves Bluetooth High Data Throughput technology to give product makers an early hardware path toward the next generation of Bluetooth audio.
HDT is expected to raise peak throughput from about 2Mbps to approximately 7.5Mbps, supporting lossless audio, lower latency, and faster over-the-air updates. For loudspeakers, the notable change is native room for multichannel soundbar systems with wireless satellites and subwoofers rather than stereo endpoints alone.
ATS296X is undergoing interoperability testing and the relevant Bluetooth core specification has not yet completed adoption. Product timing and final profile support therefore remain open, but the move from draft technology into a commercial SoC family is a concrete step for wireless system designers.